Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...
Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...
Here, Vidya Vijay, Director of Business Development at Nordson Test and Inspection, examines how intelligent in-situ sensing ...
How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...
Tom's Hardware on MSN
Intel 18A wafer-to-wafer yield issues fixed, report claims
Intel reportedly solves one of the key issues that plagued its 18A process technology, but others may still be there.
The linear motors accelerate extremely fast, at rates of up to 150 metres per second squared. That is comparable to a car ...
Unpatterned wafer inspection, which has flown well under the radar for most of the semiconductor industry, is becoming more critical amid the need to find defects earlier in the manufacturing process ...
The OCI MSA settled the architecture for optical scale-up. How fast bandwidth scales is a manufacturing question, not an ...
To support McCrometer’s European customers, the high-accuracy, virtually no-maintenance Wafer-Cone Flow Meter meets the requirements of the European Community’s Pressure Equipment Directive (PED) ...
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