Abstract: In this paper, we present an alloy via-filling method that does not need pre-metallization of via holes and can be realized on wafer level. Through-Silicon Via(TSV)/Through Glass Via(TGV) ...
Abstract: We developed a Cu paste that can be used as a filling material for a through-glass via (TGV). A TGV substrate can be filled with Cu paste without voids by using the vacuum-press method. A Cu ...
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