IEEE

Thickness Measurement and Surface-Defect Detection for Metal Plate Using Pulsed Eddy Current Testing and Optimized Res2Net Network

Abstract: Pulsed eddy current (PEC) testing is a nondestructive testing (NDT) method, which is highly suitable for thickness measurement and sub-surface-defect detection. In this article, PEC testing ...
IEEE

High-Precision Thickness Measurement of Cu Film on Si-Based Wafer Using Erasable Printed Eddy Current Coil and High-Sensitivity Associated Circuit Techniques

Abstract: The eddy current coil is widely adopted to measure the thickness of copper (Cu) film on the silicon (Si) based wafer. However, the lift-off distance (LOD) variation between the coil and Cu ...
C&EN

Thickness Dependence of Liquid−Liquid Phase Separation in Thin Films of a Polyolefin Blend

† State Key Laboratory of Polymer Physics and Chemistry, Joint Laboratory of Polymer Science and Materials, Beijing National Laboratory for Molecular Sciences, Institute of Chemistry, CAS, Beijing ...